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1

Effects of Slurry in Cu Chemical Mechanical Polishing (CMP) of TSVs for 3-D IC Integration

Jui-Chin Chen, Lau, J.H., Pei-Jer Tzeng, Shang-Chun Chen, Chien-Ying Wu, Chien Chou Chen, Yu Chen Hsin, Yi-Feng Hsu, Shang Hung Shen, Sue-Chen Liao, Chi-Hon Ho, Cha-Hsin Lin, Tzu-Kun Ku, Ming-Jer Kao

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2012

Langue:

english

Fichier:

PDF, 1.76 MB

english, 2012

2

Blind adaptive DS/CDMA receivers for multipath and multiuser environments

Fan,, Jun-Da Chen,, Shang-Chun Tsai,, Po-Yu Chen,

Journal:

IEEE Transactions on Circuits and Systems I Fundamental Theory and Applications

Année:

2006

Langue:

english

Fichier:

PDF, 746 KB

english, 2006

3

[IEEE 2013 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA) - Hsinchu (2013.4.22-2013.4.24)] 2013 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA) - Study of TSV filling performance with wide-range pattern densities by using a novel plating chamber with surface paddle agitation

Shang-Chun Chen,, Yiu-Hsiang Chang,, Yu-Chen Hsin,, Chien-Chou Chen,, Jui-Chin Chen,, Po-chih Chang,, Pei-Jer Tzeng,, Sue-Chen Liao,, Shin-Chiang Chen,, Chung-Chih Wang,, Tzu-Chien Hsu,, Yu

Année:

2013

Langue:

english

Fichier:

PDF, 993 KB

english, 2013

4

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Process integration of 3D Si interposer with double-sided active chip attachments

Tzeng, Pei-Jer, Lau, John H., Zhan, Chau-Jie, Hsin, Yu-Chen, Chang, Po-chih, Chang, Yiu-Hsiang, Chen, Jui-Chin, Chen, Shang-Chun, Wu, Chien-Ying, Lee, Ching-Kuan, Chang, Hsiang-Hung, Chien, Chun-Hsien

Année:

2013

Langue:

english

Fichier:

PDF, 1.88 MB

english, 2013

5

[IEEE 2008 IEEE Vehicular Technology Conference (VTC 2008-Spring) - Marina Bay, Singapore (2008.05.11-2008.05.14)] VTC Spring 2008 - IEEE Vehicular Technology Conference - Smart Antennas for Multi-Rate MC-CDMA Communication Systems

Tsai, Shang-Chun, Ueng, Fang-Biau, Chen, Jun-Da, Jeng, Li-Der, Chen, Jian-Wei, Ke, Kun-Da

Année:

2008

Langue:

english

Fichier:

PDF, 601 KB

english, 2008

6

[IEEE 2013 IEEE International 3D Systems Integration Conference (3DIC) - San Francisco, CA, USA (2013.10.2-2013.10.4)] 2013 IEEE International 3D Systems Integration Conference (3DIC) - Challenges of Cu CMP of TSVs and RDLs fabricated from the backside of a thin wafer

Chen, Jui-Chin, Lau, John H., Hsu, Tzu-Chien, Chen, Chien-Chou, Tzeng, Pei-Jer, Chang, Po-Chih, Chien, Chun-Hsien, Chang, Yiu-Hsiang, Chen, Shang-Chun, Hsin, Yu-Chen, Liao, Sue-Chen, Lin, Cha-Hsin, Ku

Année:

2013

Langue:

english

Fichier:

PDF, 482 KB

english, 2013

7

Influences of urea and sodium nitrite on surface coating of plasma electrolytic oxidation

Yeh, Shang-Chun, Tsai, Dah-Shyang, Guan, Sheng-Yong, Chou, Chen-Chia

Journal:

Applied Surface Science

Année:

2015

Langue:

english

Fichier:

PDF, 3.61 MB

english, 2015

8

[IEEE 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2016.10.26-2016.10.28)] 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Backside-TSV process development and integration for 2∼3um small size TSV

Hsu, Tzu-Chien, Chang, Po-Chih, Wang, Chung-Chih, Chang, Yiu-Hsiang, Chen, Tsuen-Sung, Hsin, Yu-Chen, Chen, Jui-Chin, Lee, Yuan-Chang, Chen, Shang-Chun, Wang, Jen-Chun, Hsu, Chao-Kai, Lin, Su-Hsin, Lo

Année:

2016

Langue:

english

Fichier:

PDF, 1.29 MB

english, 2016

9

[IEEE 2019 IEEE 16th International Conference on Group IV Photonics (GFP) - Singapore, Singapore (2019.8.28-2019.8.30)] 2019 IEEE 16th International Conference on Group IV Photonics (GFP) - Characterization of Silicon Photonics Modulator Integration and High Efficiency Testing Platform

Chang, Po-Chih, Chen, Shang-Chun, Chen, Ting-Hui, Chen, Wei-Yen, Hsu, Chih-Hsiang, Huang, Chien-Ying, Ku, Kai-Ning, Lee, Ming-Chang, Lee, Tai-Hsin, Lin, Chen-Yu, Lin, Chien-Chung, Wang, Chung-Chih, Wu

Année:

2019

Langue:

english

Fichier:

PDF, 301 KB

english, 2019

10

Adaptive MDPSK DS/CDMA receivers with performance analysis

Jun-Da Chen, Fang-Biau Ueng, Shang-Chun Tsai, Jui-Chi Chang, Wei-Chuan Chen

Journal:

Transactions on Emerging Telecommunications Technologies

Année:

2009

Langue:

english

Fichier:

PDF, 733 KB

english, 2009

11

Using the implantable electrical stimulator for peripheral nerve rehabilitation: A study in an animal model

Bi-yu Rui, Bing-fang Zeng, Jin-wu Wang, Shang-chun Guo, Xin Chen

Journal:

Journal of Shanghai Jiaotong University (Science)

Année:

2009

Langue:

english

Fichier:

PDF, 369 KB

english, 2009

12

Increase of urinary concentrations of 8-hydroxy-2′-deoxyguanosine in diesel exhaust emission inspector exposed to polycyclic aromatic hydrocarbons

Mei-Wen Lee, Mei-Lien Chen, Shih-Chun Candice Lung, Chung-Jung Tsai, Chao-Feng Steven Lai, Shang-Chun Yang, I-Fang Mao

Journal:

International Archives of Occupational and Environmental Health

Année:

2012

Langue:

english

Fichier:

PDF, 251 KB

english, 2012

13

Adaptive Detectors for MIMO DS/CDMA Communication Systems

Fang-Biau Ueng, Shang-Chun Tsai, Jun-Da Chen

Journal:

IEEE Transactions on Vehicular Technology

Année:

2008

Langue:

english

Fichier:

PDF, 669 KB

english, 2008

14

Insights into the antibacterial and immunomodulatory functions of tilapia hepcidin (TH)2-3 against Vibrio vulnificus infection in mice

Chieh-Yu Pan, Shang-Chun Lee, Venugopal Rajanbabu, Cheng-Hui Lin, Jyh-Yih Chen

Journal:

Developmental & Comparative Immunology

Année:

2012

Langue:

english

Fichier:

PDF, 1.18 MB

english, 2012

15

Antimicrobial peptide of an anti-lipopolysaccharide factor modulates of the inflammatory response in RAW264.7 cells

Ming-Ching Lin, Shih-Bin Lin, Shang-Chun Lee, Ching-Chun Lin, Cho-Fat Hui, Jyh-Yih Chen

Journal:

Année:

2010

Langue:

english

Fichier:

PDF, 1.28 MB

english, 2010

16

The antimicrobial peptide, epinecidin-1, mediates secretion of cytokines in the immune response to bacterial infection in mice

Shang-Chun Lee, Chieh-Yu Pan, Jyh-Yih Chen

Journal:

Année:

2012

Langue:

english

Fichier:

PDF, 1.30 MB

english, 2012

17

Adaptive DS-CDMA Receiver with Code Tracking in Phase Unknown Environments

Fang-Biau Ueng,, Jun-Da Chen,, Shang-Chun Tsai

Journal:

IEEE Transactions on Wireless Communications

Année:

2008

Langue:

english

Fichier:

PDF, 488 KB

english, 2008

18

[IEEE IEEE/ACES International Conference on Wireless Communications and Applied Computational Electromagnetics, 2005. - Honolulu, HI (3-7 April, 2005)] IEEE/ACES International Conference on Wireless Communications and Applied Computational Electromagnetics, 2005. - Multiuser Detectors for MIMO DS/CDMA Systems

Fang-Biau Ueng,, Shang-Chun Tsai,, Jun-Da Chen,

Année:

2005

Langue:

english

Fichier:

PDF, 271 KB

english, 2005

19

[IEEE IEEE/SP 13th Workshop on Statistical Signal Processing, 2005 - Bordeaux, France (July 17-20 2005)] IEEE/SP 13th Workshop on Statistical Signal Processing, 2005 - An Iterative Method for Blind Equalization of Multiple FIR Channels

Fang-Biau Ueng,, Shang-Chun Tsai,, Jun-Da Chen,, Shiann-Jeng Yu,

Année:

2005

Langue:

english

Fichier:

PDF, 195 KB

english, 2005

20

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Effects of etch rate on scallop of through-silicon vias (TSVs) in 200mm and 300mm wafers

Hsin, Yu-Chen, Chen, Chien-Chou, Lau, John H., Tzeng, Pei-Jer, Shen, Shang-Hung, Hsu, Yi-Feng, Chen, Shang-Chun, Wn, Chien-Ying, Chen, Jui-Chin, Ku, Tzu-Kun, Kao, Ming-Jer

Année:

2011

Langue:

english

Fichier:

PDF, 3.21 MB

english, 2011

21

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - A thermal performance measurement method for blind through silicon vias (TSVs) in a 300mm wafer

Chien, Heng-Chieh, Chao, Yu-Lin, Lau, John H., Tain, Ra-Min, Dai, Ming-Ji, Tzeng, Pei-Jer, Lin, Cha-Hsin, Hsin, Yu-Chen, Chen, Shang-Chun, Chen, Jui-Chin, Chen, Chien-Chou, Ho, Chi-Hon, Lo, Wei-Chung,

Année:

2011

Langue:

english

Fichier:

PDF, 1.67 MB

english, 2011

22

[IEEE 2007 16th IST Mobile and Wireless Communications Summit - Budapest, Hungary (2007.07.1-2007.07.5)] 2007 16th IST Mobile and Wireless Communications Summit - Joint Detection and PN Timing Recovery for DS/CDMA Systems with Smart Antenna

Tsai, Shang-Chun, Ueng, Fang-Biau, Chen, Jun-Da, Liao, Yen-Han, Shen, Ye-Shun

Année:

2007

Langue:

english

Fichier:

PDF, 419 KB

english, 2007

23

[IEEE 2014 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA) - Hsinchu, Taiwan (2014.4.28-2014.4.30)] Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA) - Technologies and challenges of fine-pitch backside via-last 3DIC TSV process integration and its electrical characteristics and system applications

Chen, Erh-Hao, Tzu-Chien Hsu,, Cha-Hsin Lin,, Tzeng, Pei-jer, Chung-Chih Wang,, Shang-Chun Chen,, Chen, Jui-Chin, Chien-Chou Chen,, Hsin, Yu-Chen, Po-Chih Chang,, Yiu-Hsiang Chang,, Shin-Chiang

Année:

2014

Langue:

english

Fichier:

PDF, 760 KB

english, 2014

24

[IEEE 2008 4th IEEE International Conference on Circuits and Systems for Communications (ICCSC 2008) - Shanghai, China (2008.05.26-2008.05.28)] 2008 4th IEEE International Conference on Circuits and Systems for Communications - Adaptive Noncoherent DS/CDMA Receivers with MDPSK Signals

Chang, Jui-Chi, Ueng, Fang-Biau, Chen, Jun-Da, Tsai, Shang-Chun, Chen, Wei-Chuan, Jeng, Li-Der

Année:

2008

Langue:

english

Fichier:

PDF, 569 KB

english, 2008

25

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - An innovative bumpless stacking with through silicon via for 3D Wafer-on-Wafer (WOW) integration

Liao, Sue-Chen, Chen, Erh-Hao, Chen, Chien-Chou, Chen, Shang-Chun, Chen, Jui-Chin, Chang, Po-Chih, Chang, Yiu-Hsiang, Lin, Cha-Hsin, Ku, Tzu-Kun, Kao, Ming-Jer, Kim, Young Suk, Maeda, Nobuhide, Kodama

Année:

2014

Langue:

english

Fichier:

PDF, 952 KB

english, 2014

26

[IEEE Proceedings of 2010 International Symposium on VLSI Technology, System and Application - Hsin Chu, Taiwan (2010.04.26-2010.04.28)] Proceedings of 2010 International Symposium on VLSI Technology, System and Application - An extensive study for the impacts of structure-wise TSVs on position-oriented MOSFETs with TSV signal disturbance

Tzeng, Pei-Jer, Wang, Chung-Chih, Chang, Li-Hsin, Chen, Shang-Chun, Shen, Shang-Hung, Shen, Chih-Ta, Wang, Shih-Hui, Liao, Sue-Chen, Lin, Cha-Hsin, Shu, Dun-Ying, Lee, Chwan-Ying, Kao, Ming-Jer

Année:

2010

Langue:

english

Fichier:

PDF, 644 KB

english, 2010

27

[IEEE 2006 10th IEEE Singapore International Conference on Communication Systems - Singapore (2006.10.30-2006.11.1)] 2006 10th IEEE Singapore International Conference on Communication Systems - Multirate CDMA Receivers with Adaptive Antennas in Multipath Fading Channels

Ueng, Fang-biau, Chen, Jun-da, Tsai, Shang-chun, Lin, Cen-lan

Année:

2006

Langue:

english

Fichier:

PDF, 5.23 MB

english, 2006

28

[IEEE 2012 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA) - Hsinchu (2012.04.23-2012.04.25)] Proceedings of Technical Program of 2012 VLSI Technology, System and Application - Key enabling technologies of 300mm 3DIC process integration

Pei-Jer Tzeng,, Yu-Chen Hsin,, Jui-Chin Chen,, Shang-Chun Chen,, Chien-Ying Wu,, Wen-Li Tsai,, Chung-Chih Wang,, Chi-Hon Ho,, Chien-Chou Chen,, Yi-Feng Hsu,, Shang-Hung Shen,, Sue-Chen Liao

Année:

2012

Langue:

english

Fichier:

PDF, 522 KB

english, 2012

29

[IEEE IEEE Globecom 2006 - San Francisco, CA, USA (2006.11.27-2006.12.1)] IEEE Globecom 2006 - WLC30-2: Channel Assignment and Routing for Multi-Channel Wireless Mesh Networks Using Simulated Annealing

Chen, Ying-Yu, Liu, Shang-Chun, Chen, Chien

Année:

2006

Langue:

english

Fichier:

PDF, 348 KB

english, 2006

30

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Design, fabrication, and calibration of stress sensors embedded in a TSV interposer in a 300mm wafer

Tzeng, Pei-Jer, Lau, John H., Dai, Ming-Ji, Wu, Sheng-Tsai, Chien, Heng-Chieh, Chao, Yu-Lin, Chen, Chien-Chou, Chen, Shang-Chun, Wu, Chien-Ying, Lee, Ching-Kuan, Zhan, Chau-Jie, Chen, Jui-Chin, Hsu, Y

Année:

2012

Langue:

english

Fichier:

PDF, 2.49 MB

english, 2012

31

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Fine-pitch backside via-last TSV process with optimization on temporary glue and bonding conditions

Chen, Erh-Hao, Hsu, Tzu-Chien, Lin, Cha-Hsin, Tzeng, Pei-jer, Wang, Chung-Chih, Chen, Shang-Chun, Chen, Jui-Chin, Chen, Chien-Chou, Hsin, Yu-Chen, Chang, Po-Chih, Chang, Yiu-Hsiang, Chen, Shin-Chiang,

Année:

2013

Langue:

english

Fichier:

PDF, 832 KB

english, 2013

32

[IEEE The 2004 IEEE Asia-Pacific Conference on Circuits and Systems, 2004. - Tainan, Taiwan (Dec. 6-9, 2004)] The 2004 IEEE Asia-Pacific Conference on Circuits and Systems, 2004. Proceedings. - Adaptive receivers with PN code tracking for DS-CDMA communications

Fang-Biau Ueng,, Jun-Da Chen,, Shang-Chun Tsai,

Année:

2004

Langue:

english

Fichier:

PDF, 288 KB

english, 2004

33

[IEEE 2015 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA) - Hsinchu, Taiwan (2015.4.27-2015.4.29)] 2015 International Symposium on VLSI Technology, Systems and Applications - Low-cost 3DIC process technologies for wide-I/O memory cube

Chen, Jui-Chin, Chen, Erh-Hao, Tzeng, Pei-Jer, Lin, Cha-Hsin, Wang, Chung-Chih, Chen, Shang-Chun, Hsu, Tzu-Chien, Chen, Chien-Chou, Hsin, Yu-Chen, Chang, Po-Chih, Chang, Yiu-Hsiang, Ku, Tzu-Kun

Année:

2015

Langue:

english

Fichier:

PDF, 509 KB

english, 2015

34

[ACM Press Proceeding of the 2006 international conference - Vancouver, British Columbia, Canada (2006.07.03-2006.07.06)] Proceeding of the 2006 international conference on Communications and mobile computing - IWCMC '06 - Adaptive MC-CDMA and MC-DS-CDMA receivers for multiuser and multipath fading communications

Ueng, Fang-Biau, Chen, Jun-Da, Tsai, Shang-Chun, Wang, Sheng-Fu, Su, Hsien, Jeng, Li-Der

Année:

2006

Langue:

english

Fichier:

PDF, 315 KB

english, 2006

35

Coloration of the aluminum alloy surface with dye emulsions while growing a plasma electrolytic oxide layer

Yeh, Shang-Chun, Tsai, Dah-Shyang, Wang, Jian-Mao, Chou, Chen-Chia

Journal:

Surface and Coatings Technology

Année:

2016

Langue:

english

Fichier:

PDF, 1.60 MB

english, 2016

36

Decreased extracellular pH inhibits osteogenesis through proton-sensing GPR4-mediated suppression of yes-associated protein

Tao, Shi-Cong, Gao, You-Shui, Zhu, Hong-Yi, Yin, Jun-Hui, Chen, Yi-Xuan, Zhang, Yue-Lei, Guo, Shang-Chun, Zhang, Chang-Qing

Journal:

Scientific Reports

Année:

2016

Langue:

english

Fichier:

PDF, 1.37 MB

english, 2016

37

3D Stacked Technology of DRAM-Logic Controller Using Through-Silicon Via (TSV)

Shen, Wen-Wei, Lin, Yu-Min, Chen, Shang-Chun, Chang, Hsiang-Hung, Chang, Tao-Chih, Lo, Wei-Chung, Lin, Chien-Chung, Chou, Yung-Fa, Kwai, Ding-Ming, Kao, Ming-Jer, Chen, Kuan-Neng

Journal:

IEEE Journal of the Electron Devices Society

Année:

2018

Langue:

english

Fichier:

PDF, 6.27 MB

english, 2018

38

Comparison of bilateral and unilateral upper limb training in people with stroke: A systematic review and meta-analysis

Chen, Pei-ming, Kwong, Patrick W. H., Lai, Claudia K. Y., Ng, Shamay S. M., Guo, Shang-Chun

Journal:

Année:

2019

Fichier:

PDF, 2.02 MB

2019

39

Effects of pontic span and fiber reinforcement on fracture strength of multi-unit provisional fixed partial dentures

Chang, Min-Chieh, Hung, Chun-Cheng, Chen, Wen-Cheng, Tseng, Shang-Chun, Chen, Yung-Chung, Wang, Jen-Chyan

Journal:

Journal of Dental Sciences

Année:

2019

Fichier:

PDF, 1.63 MB

2019

40

Fully Symmetric 3-D Transformers with Through-Silicon Via IPD Technology for RF Applications

Li, Sih-Han, Hsu, Shawn S. H., Chen, Kuan-Wei, Lin, Chih-Sheng, Chen, Shang-Chun, Zhang, Jie, Tzeng, Pei-Jer

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2019

Langue:

english

Fichier:

PDF, 1.08 MB

english, 2019

41

[IEEE 2019 IEEE 16th International Conference on Group IV Photonics (GFP) - Singapore, Singapore (2019.8.28-2019.8.30)] 2019 IEEE 16th International Conference on Group IV Photonics (GFP) - Characterization of Silicon Photonics Modulator Integration and High Efficiency Testing Platform

Chang, Po-Chih, Chen, Shang-Chun, Chen, Ting-Hui, Chen, Wei-Yen, Hsu, Chih-Hsiang, Huang, Chien-Ying, Ku, Kai-Ning, Lee, Ming-Chang, Lee, Tai-Hsin, Lin, Chen-Yu, Lin, Chien-Chung, Wang, Chung-Chih, Wu

Année:

2019

Fichier:

PDF, 301 KB

2019

42

[IEEE 2019 IEEE 16th International Conference on Group IV Photonics (GFP) - Singapore, Singapore (2019.8.28-2019.8.30)] 2019 IEEE 16th International Conference on Group IV Photonics (GFP) - Characterization of Silicon Photonics Modulator Integration and High Efficiency Testing Platform

Chen, Shang-Chun, Lee, Tai-Hsin, Huang, Chien-Ying, Chen, Ting-Hui, Lee, Ming-Chang, Lin, Chien-Chung, Wun, Sin-Jhu, Hsu, Chih-Hsiang, Lin, Chen-Yu, Zhang, Jie, Ku, Kai-Ning, Chang, Po-Chih, Wang, Chu

Année:

2019

Fichier:

PDF, 295 KB

2019

43

Challenges of using blooms of Microcystis spp. in animal feeds: A comprehensive review of nutritional, toxicological and microbial health evaluation

Chen, Liang, Giesy, John P., Adamovsky, Ondrej, SvirÄev, Zorica, Meriluoto, Jussi, Codd, Geoffrey A., Mijovic, Biljana, Shi, Ting, Tuo, Xun, Li, Shang-Chun, Pan, Bao-Zhu, Chen, Jun, Xie, Ping

Journal:

Science of The Total Environment

Année:

2020

Fichier:

PDF, 2.69 MB

2020

44

[IEEE 2020 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) - Hsinchu, Taiwan (2020.8.10-2020.8.13)] 2020 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) - Analysis of Racetrack-Coupled Mach Zehnder Interferometer for High-Speed Communication

Ku, Kai-Ning, Chang, Po-Chih, Wang, Chung-Chih, Lin, Chen-Yu, Hsu, Chi-Hsiang, Chen, Ting-Hui, Huang, Chien-Ying, Wun, Sin-Jhu, Lee, Chi-Sen, Chen, Shang-Chun, Lee, Ming-Chang, Lin, Chien-Chung, Wu, C

Année:

2020

Fichier:

PDF, 237 KB

2020